JPS6214930B2 - - Google Patents
Info
- Publication number
- JPS6214930B2 JPS6214930B2 JP11854179A JP11854179A JPS6214930B2 JP S6214930 B2 JPS6214930 B2 JP S6214930B2 JP 11854179 A JP11854179 A JP 11854179A JP 11854179 A JP11854179 A JP 11854179A JP S6214930 B2 JPS6214930 B2 JP S6214930B2
- Authority
- JP
- Japan
- Prior art keywords
- grain boundary
- boundary insulated
- insulated semiconductor
- semiconductor porcelain
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 55
- 229910052573 porcelain Inorganic materials 0.000 claims description 33
- 239000003990 capacitor Substances 0.000 claims description 18
- 238000007772 electroless plating Methods 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000003985 ceramic capacitor Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11854179A JPS5642325A (en) | 1979-09-14 | 1979-09-14 | Production of layerrbuilt semiconductor ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11854179A JPS5642325A (en) | 1979-09-14 | 1979-09-14 | Production of layerrbuilt semiconductor ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5642325A JPS5642325A (en) | 1981-04-20 |
| JPS6214930B2 true JPS6214930B2 (en]) | 1987-04-04 |
Family
ID=14739137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11854179A Granted JPS5642325A (en) | 1979-09-14 | 1979-09-14 | Production of layerrbuilt semiconductor ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5642325A (en]) |
-
1979
- 1979-09-14 JP JP11854179A patent/JPS5642325A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5642325A (en) | 1981-04-20 |
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